The Chip Technology That Finally Gives Intel an Edge Over TSMC

Published: Wednesday, January 21, 2026 at 11:42 am

Intel Gains Manufacturing Edge with New Chip Technology

Intel is making a significant stride in the competitive semiconductor market with the launch of its Panther Lake CPUs, the first chips utilizing the advanced Intel 18A process node. This marks a pivotal moment for the company as it seeks to regain its footing against rival TSMC. Intel has not only closed the manufacturing gap with TSMC but has also taken the lead in implementing backside power delivery, a technology that promises to enhance chip performance and efficiency.

Backside power delivery, a key innovation, separates power connections from interconnects, the tiny wires that connect chip components. This separation reduces interference and improves performance, especially as chips become more complex. Intel's implementation, called PowerVia, is already shipping in Panther Lake laptops, offering a tangible benefit. Early testing indicates a 6% increase in chip frequency, allowing chips to run faster with the same power consumption or use less power while maintaining performance.

While TSMC is also developing its own version of backside power delivery, named Super Power Rail, Intel has a head start. TSMC's A16 process node, which will incorporate Super Power Rail, is expected to enter production by the end of 2026, giving Intel a lead of between six months to a year.

Intel's innovation doesn't stop there. The company is also planning to introduce its Intel 14A process in 2027, potentially beating TSMC to market again, this time with High-NA EUV lithography. TSMC is not expected to start using High-NA EUV tools until 2028.

This technological advancement could be crucial for Intel's foundry business, which is seeking to attract external customers. The company's pioneering efforts in backside power delivery and High-NA EUV lithography could be key to transforming its foundry business into a long-term success.

BNN's Perspective:

Intel's recent advancements are encouraging. While the semiconductor industry is fiercely competitive, Intel's focus on innovation, particularly in areas like backside power delivery, is a positive sign. This could lead to greater competition and ultimately benefit consumers through improved technology and potentially lower prices. However, the industry remains volatile, and Intel must maintain its momentum to secure its position.

Keywords: Intel, TSMC, Panther Lake, CPUs, Intel 18A, backside power delivery, PowerVia, Super Power Rail, A16, Intel 14A, High-NA EUV, semiconductor, chip technology, manufacturing, innovation, foundry

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